Method, apparatus for holding and treatment of a substrate

ABSTRACT

Some embodiments discussed relates to an apparatus for holding a substrate, comprising a body with a surface for a semiconductor wafer to rest on, with the surface having a first surface area on which a first area of the semiconductor wafer can rest, and a second surface area on which a second area of the semiconductor wafer can rest, wherein the second surface area protrudes with respect to the first surface area.

RELATED APPLICATIONS

This patent application is a Division of U.S. application Ser. No.11/851,976, filed Sep. 7, 2007, which claims the benefit of priority,under 35 U.S.C. Section 119, to German Patent Application Serial Number10 2006 042 026.8, filed on Sep. 7, 2006, which applications areincorporated herein by reference in their entirety.

BACKGROUND

The present invention relates to an apparatus for holding a substrate,in particular a semiconductor substrate or wafer. The present inventionfurthermore relates to a method for treatment of a substrate.

Miniaturized components, for example integrated electrical circuits, areincreasingly being produced on planar substrates. The prominentsubstrate type for components is semiconductor wafers which, duringprocessing, are used not only as a mount but, owing to the capability tomanipulate their conductance characteristics and the capability tostructure them finely, are normally themselves part of the circuit.Hundreds of highly complex electronic circuit units can thus be producedon one semiconductor wafer.

In order to save space, to reduce costs and to improve the functionalityof the components, very small structures are grown, applied to, etchedor implanted in and on the semiconductor wafers. During this process,the structures must be tested repeatedly on the wafer and must beidentified in order to verify the respective process step. Finally, thesemiconductor wafers are normally sawed in order to obtain theindividual circuit units (chips) from a semiconductor wafer.

In order to allow the structures to be produced, to be tested and to besawed on a semiconductor wafer, the semiconductor wafers must be held ina well-defined position during the processing, must be supplied withwell-defined electrical potentials, and/or must be subjected towell-defined environmental parameters, such as temperature or pressure.For this purpose, semiconductor wafers are normally placed on asemiconductor wafer holder (chuck). Owing to the high sensitivity of thesemiconductor wafer surface to scratching, and the fragile nature of thebrittle semiconductor material as the semiconductor wafer diameterincreases, the semiconductor wafer holders must be designed such thatthe semiconductor wafer can be placed down, held and passed on again ina manner which protects it. The surface of the semiconductor waferholders should also be such that scratching of the semiconductor waferscan be prevented.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be explained in more detail in the following text, byway of example, by means of the following figures:

FIGS. 1 a-1 b show two mutually perpendicular sections through anapparatus for holding a substrate with a first surface area and a secondsurface area, in which a semiconductor wafer is placed on the apparatus,according some embodiments of the invention.

FIG. 2 shows an apparatus for holding a substrate as in FIG. 1 a, inwhich the second surface area is arranged such that it can move withrespect to the first surface area, according to some embodiments of theinvention.

FIG. 3 shows an apparatus for holding a substrate as in FIG. 1 a, inwhich the first and the second surface areas are formed in aninterlocking manner with respect to the semiconductor wafer, accordingto some embodiments of the invention.

FIG. 4 shows an apparatus for holding a substrate as in FIG. 1 a, inwhich the tips of contact needles form the second surface area,according to some embodiments of the invention.

FIG. 5 shows a measurement apparatus for measurement of a semiconductorwafer, according to some embodiments of the invention.

FIG. 6 shows an apparatus for marking and separation of a substrate,according to some embodiments of the invention.

FIGS. 7 a-7 c show a method for treatment of a semiconductor wafer,according to some embodiments of the invention.

DETAILED DESCRIPTION

The following detailed description refers to the accompanying drawingsthat show, by way of illustration, specific details and embodiments inwhich the invention may be practiced. These embodiments are described insufficient detail to enable those skilled in the art to practice theinvention. Other embodiments may be utilized and structural, logical,and electrical changes may be made without departing from the scope ofthe invention. The various embodiments are not necessarily mutuallyexclusive, as some embodiments can be combined with one or more otherembodiments to form new embodiments. In this document, the terms “a” or“an” are used, as is common in patent documents, to include one or morethan one. In this document, the term “or” is used to refer tononexclusive or, such that “A or B” includes “A but not B,” “B but notA,” and “A and B,” unless otherwise indicated.

In the following description, the terms “wafer” and “substrate” may beused interchangeably to refer generally to any structure on whichintegrated circuits are formed and also to such structured duringvarious stages of integrated circuit fabrication. The term “substrate”is understood to include a semiconductor wafer. The term “substrate” isalso used to refer to semiconductor structures during processing and mayinclude other layers that have been fabricated thereupon. Both “wafer”and “substrate” include doped and undoped semiconductors, epitaxialsemiconductor layers supported by a base semiconductor or insulator, aswell as other semiconductor structures well known to one skilled in theart.

The expression an apparatus for holding a substrate, referred to in thefollowing text as a substrate holder, can be understood as meaningholding structures or table apparatuses which can hold a substrate. Ifthe substrate is a semiconductor wafer, then the substrate holder is,for example, a semiconductor wafer holder or a “chuck”. The substrateholder comprises a body on which the semiconductor wafer can be placed,so that the semiconductor wafer is held by gravitation. In addition, thesemiconductor wafer may, however, also be held on the substrate holder,for example, by a reduced pressure between the body and the substrate,by electrostatic attraction force between the body and the substrate,and/or by clamping apparatuses between the body and the substrate.Holders such as these ensure that the semiconductor wafer is held on thebody even when the substrate holder is tilted, is accelerated laterally,or if forces are applied to the substrate wafer laterally with respectto the substrate plane.

In this context, the expression a “body” means one or more body elementswhich are shaped such that they have a first and a second surface area,on both of which the semiconductor wafer can be placed. If the body is aone body element, then this may be integral, which simplifies theproduction and control of the body. In some embodiments, the body may bea solid body composed of a solid conductive material, for example ametal such as aluminium, copper or brass, or a solid insulatingmaterial, for example ceramic, Teflon®, a different plastic, etc.

The expression “semiconductor wafer” may mean a wafer which is composedpredominantly of a semiconductor material, that is to say for example ofsilicon, germanium, or a compound such as SiC, GaAs, SiGe, InP, GaN.Semiconductor wafers are sawed into wafers from a monocrystallinecrystal bar (ingot) in the form of a pillar. The diameter of thesemiconductor wafers corresponds to the diameter of the crystal bar inthe form of a pillar. The industry standard for the diameter of thesemiconductor wafers is 1 inch, 2 inches, 3 inches, 4 inches, 5 inches,6 inches, 8 inches or 12 inches (or 300 mm). The thicknesses of the sawnsemiconductor wafers are more typically, depending on the application,between 300 and 800 micrometers.

The present invention relates to an apparatus for holding a substrate,which comprises a body with a surface for a semiconductor wafer to reston, in which the surface has a first surface area in which a first areaof the semiconductor wafer can rest, and a second surface area in whicha second area of the semiconductor wafer can rest, and in which thesecond surface area projects with respect to the first surface area.

The apparatus for processing of a substrate may, for example, be: (a) aseparation apparatus for separation of the semiconductor wafer; (b) amarking apparatus for marking of the semiconductor wafer; (c) acontact-making apparatus for making contact with the semiconductorwafer; (d) a vacuum apparatus for pressing the semiconductor wafer ontothe body; and/or (e) at least one voltage source for application of avoltage between the body and the semiconductor wafer.

The first surface area of the body, which projects with respect to thesecond surface area of the body, makes it possible for a semiconductorwafer with a stepped surface profile, for example with a step, to reston the body. This ensures that semiconductor wafers which have beenselectively thinned in one surface area are mechanically supported bothin the thin area and in the thick area, so that the thin area does notbend excessively or break.

In the following text, the expression selected thinning of asemiconductor wafer can be understood as meaning removal ofsemiconductor wafer material on subareas of a main surface of thesemiconductor wafer, so that the semiconductor wafer is thicker in oneor more first areas than in the one or more second areas in which thesurface material has been removed. In this case, the surface materialcan be removed in subareas by, for example, selective chemical orelectrochemical etching, by mechanical plasma or by laser methods.

The selectivity can be made possible, for example, by means of a maskwhich covers subareas of the semiconductor wafer surface in order thatthey are not etched, or are etched only slightly, and leaves other areasof the semiconductor wafer open, in order that the etching can takeplace to a greater extent there. The etching may, for example, be dryetching or wet etching. The selective etching on the main surface of thesemiconductor wafer thus results in thick semiconductor wafer areas(first area) and thinned semiconductor wafer areas (second area).

In many cases, semiconductor wafers are structured with a differentthickness such that they are thicker in the outer area than in the innerarea. The greater thickness in the outer area provides a greatermechanical robustness for the substrate while in the inner area, thethickness is reduced for a desired application. The mechanicalrobustness is achieved, in particular, when the outer thick areacompletely surrounds the inner thin area in the semiconductor waferplane. It is preferable for the first area and the second area of thesemiconductor wafer to be concentric with respect to a common axis.

In the field of microelectronics, there is often interest in minimizingthe semiconductor chip thickness in order, for example, to minimize thechip package thickness or, for power transistors, the electricalresistance from the chip front face to the rear face. In this case,semiconductor wafers produced in a standard manner are often used forthe production of the chips and are subsequently selectively thinned inthe inner area from a main surface side, for example by means of maskedetching, mechanical grinding, dry or wet-chemical etching, mechanicalpolishing or laser removal. This results in two areas with two differentthicknesses being produced on the semiconductor wafer. If, for example,a concentric outer area of the semiconductor wafer is masked duringetching, then a “ring” with a thickness of, for example, 100 to 1000micrometers is left in the outer area of the semiconductor wafer afterthe etching process and after removal of the mask, while the thicknessof the semiconductor wafer within this ring is reduced, for example, to30 to 500 micrometers, depending on the thickness of the originalmaterial. The method for selective thinning of a semiconductor wafer isknown per se, and will not be explained any further here.

It should be noted that there is no need for the thick area of asemiconductor wafer to correspond to an external ring. The thick areamay just as well have a quadrilateral shape, may be a ring with one ormore interruptions, or may be located in the inner area of thesemiconductor wafer. Furthermore, there is no limitation on the size ofthe semiconductor wafer used. The semiconductor wafer can be either a 1inch, 4 inch, 6 inch, 8 inch or a 12 inch wafer. The thickness of thesemiconductor wafer before thinning may in each case be between 100 and1000 micrometers or more. The extent of thinning of the semiconductorwafer can be controlled in a simple manner by the duration of materialremoval. At the moment, the process typically starts with an 8 inchwafer with a thickness of 725 micrometers, with the annular outer areabeing thinned to 400 micrometers and the inner area of this “ring” beingthinned to 150 micrometers. In some embodiments, it can be desirable toreduce the thicknesses in the inner area down to 40 micrometers.

The first surface area of the surface and the second surface area of thesurface are preferably arranged in a coplanar form with respect to oneanother. The rigid arrangement is particularly advantageous when thesemiconductor wafers to be processed have the same geometry and inparticular the same thickness differences, so that the same substrateholder can be used successively for a large number of semiconductorwafers.

In some embodiments, the first and the second surface area are arrangedsuch that they can move or can be adjusted with respect to one another.In this case, the substrate holder may hold substrate wafers ofdifferent geometry in an interlocking manner. For example, a springingin the body can ensure that a force which forces the surface areas apartfrom one another acts between the first and the second surface area, sothat the second surface area is pressed by the spring force against thethinned (second) area of the semiconductor wafer. This also makes itpossible to ensure the interlocking nature, even when differentsemiconductor wafers are thinned to different extents.

In some embodiments, the body has at least one opening in the firstand/or second surface area. A connection to a reduced-pressure reservoiror to a vacuum pump can be produced via an opening such as this, bymeans of which a reduced pressure is produced in the area between thesemiconductor wafer and the surface of the substrate holder. A reducedpressure such as this can press the semiconductor wafer onto the body,so that there is good adhesion between the two. This is advantageouswhen lateral forces press on the semiconductor wafer while contact isbeing made, during sawing, during marking, and during removal from afilm, etc.

In some embodiments, the surface of the body can be connected in aninterlocking manner to the first and second area of the semiconductorwafer to be placed on it. This makes it possible to ensure that thesemiconductor wafer rests on it over the entire area, thus precludingbending of the semiconductor wafer even if the second area of thesemiconductor wafer is very thin. Furthermore, the semiconductor wafercan produce the close contact, which is provided by the interlockingnature, with the body, resulting in a good electrical or thermalcontact, when this is desirable.

Interlocking connection includes a connection in which the surface onthe thinned side of the semiconductor wafer, preferably over the entirearea, rests as closely as possible on the surface of the body of thesubstrate holder.

In this case, the distance between the surfaces in a directionvertically with respect to the second, projecting surface area should,for example, not be greater than 200 micrometers, and preferably nogreater than 100 micrometers, and even more preferably no more than 50micrometers. In the transitional area, that is to say in the area inwhich the first surface area merges into the second surface area, thedistance between the surfaces of the substrate holder body and thesemiconductor wafer should, for example, be no more than 1000micrometers, and preferably no more than 100 micrometers.

In one embodiment, the first surface area of the surface of the bodydefines a first plane, and the second surface area of the surfacedefines a second plane, which are coplanar with respect to one another.This allows the semiconductor wafers which have two differentthicknesses to be placed on the body in an interlocking manner. This isthe case in particular when the thickness difference between the firstarea and the second area of the semiconductor wafer corresponds to thedistance between the first plane and the second plane. The distancebetween the first plane and the second plane is preferably less than1000 micrometers, and is preferably less than 500 micrometers. On theother hand, it is advantageous for the distance between the two planesto be greater than 10 micrometers, or preferably greater than 200micrometers.

In some embodiments, the first surface area and the second surface areaare preferably arranged concentrically with respect to an axis. Thisallows concentric semiconductor wafers to be placed on the surface ofthe body in an interlocking manner. Furthermore, it is preferable forthe distance between the first surface area and the axis to be greaterthan 50%, and preferably greater than 95%, of the semiconductor waferradius. This ensures a sufficiently large thinned semiconductor waferarea.

Alternatively (or additionally), the surface of the bodies of thesubstrate holder may contain a dielectric layer. An electrical field canbe built up across this layer by means of an external voltage betweenthe semiconductor wafer and the body, pressing the semiconductor waferonto the surface of the body, and holding it in position. The dielectriclayer is preferably an oxide, a ceramic or a polymer which has beengrown on or applied to the body.

The invention also relates to a method for treatment of a substrate, inwhich a semiconductor wafer which is thicker in a first surface areathan in a second surface area is placed on an apparatus for holding thesemiconductor wafer, in which the semiconductor wafer rests on it atleast at one point in each case, both in the first surface area and inthe second surface area, and in which the semiconductor wafer isprocessed on the apparatus.

If the processing of the semiconductor wafer involves the semiconductorwafer being pressed onto the body, then this contact pressure can beproduced, for example, by production of a reduced pressure between thesemiconductor wafer and the body, by production of an electrical voltagebetween the semiconductor wafer and the body, or by mechanicalspringing.

If the processing of the semiconductor wafer involves separation of thesemiconductor wafer from a mount, then this separation of thesemiconductor wafer from the mount can be carried out by means of thesubstrate holder, which, for example, is pressed by means of a vacuum,electrostatic attraction or mechanically onto the semiconductor wafer.The mount (for example glass, adhesive) can then mechanically beseparated from the semiconductor wafer. The mount is, for example, usedas a base for the thinning process of the semiconductor wafer, and canbe removed again after the thinning process.

If the processing of the semiconductor wafer involves coating or etchingof the semiconductor wafer, then this coating process is preferablycarried out in a sputtering chamber or a plasma reactor.

If the processing of the semiconductor wafer involves making contactwith the semiconductor wafer, then the body is used to support thesemiconductor wafer against the pressure of the contact-making elements.The contact-making elements may be individually adjustable contactneedles, or else needle cards with a set of preadjusted needles. Thecontact-making process can be used to test the electrical serviceabilityof the circuits which have been applied to the semiconductor wafer.

If the processing of the semiconductor wafer involves marking of thesemiconductor wafer, then the marking process is preferably carried outusing a marking system, a so-called ink machine or an inker. In thismethod, for example, the circuit units which have been identified asbeing defective can be marked with a specific ink or by means of alaser, in order to reject them after a separation process.

If the processing of the semiconductor wafer involves separation of thesemiconductor wafer, then the separation process can be carried out, forexample, by means of a saw or a laser, by means of which thesemiconductor wafers are broken up along predetermined paths (scratchframe) to form individual chips. The semiconductor wafer is preferablypressed onto the body during the sawing process by means of a reducedpressure, electrostatic attraction or by means of mechanical attachmentto the body, so that the semiconductor wafer is not moved over the bodyduring the sawing process.

If the processing of the semiconductor wafer involves transportation ofthe semiconductor wafer, then the semiconductor wafer is pressed ontothe body during the transportation process, preferably by means ofreduced pressure, electrostatic attraction or by means of mechanicalattachment to the body, in order that the semiconductor wafer does notbecome detached from the substrate holder during transportation.

Various embodiments of the invention will now be described withreference to the attached figures.

FIGS. 1 a-b show two mutually perpendicular sections through anapparatus for holding a substrate with a first surface area and a secondsurface area, in which a semiconductor wafer is placed on the apparatus,according some embodiments of the invention. FIGS. 1 a and 1 b show asubstrate holder 1 with a body 2 (substrate holder), on which asemiconductor wafer 7, for example an 8-inch silicon wafer, is placed.The semiconductor wafer 7 is selectively thinned on one main surface 8,so that the semiconductor wafer 7 can be subdivided into a first area 7a, which has not been thinned (a non-thinned area), and into a secondarea 7 b which has been thinned. In this case, the first area 7 a isarranged in the edge area of the semiconductor wafer, while the second(thinned) area 7 b is arranged in the inner area of the semiconductorwafer.

As shown in FIG. 1 b, the first area 7 a of the semiconductor wafersurrounds the second area 7 b of the semiconductor wafer in an annularshape, so that the first area 7 a and the second area 7 b are arrangedconcentrically with respect to the axis 12. The “ring” provides thethinned semiconductor wafer with mechanical robustness for the furtherprocessing. The larger the lateral width B of this ring, the greater isthe mechanical robustness of the semiconductor wafer 7, but the smalleris the area in which thin chips can be produced. The lateral width ofthe ring is thus preferably less than 10%, but greater than 1%, of thesemiconductor wafer radius R.

Thinning of the semiconductor wafer 7 is normally necessary when, forexample, space or circuitry reasons make it necessary to use chipthicknesses which are less than the thicknesses of standard availablesemiconductor wafers. For example, for vertical power transistors, it isdesirable for the chip thickness to be reduced down to 120 micrometersor even down to 40 micrometers, in order to minimize the electricalresistance for the transverse current flow, while in the case of sawingof, for example, 8-inch wafers, thicknesses of about 400 micrometers arerequired. Thin chip thicknesses are in this case achieved by thinning ofthe semiconductor wafer from a thickness of about 400 micrometers toabout 120 micrometers or even to about 40 micrometers. These figures areonly by way of example, and may be widely different, depending on theapplication. The thicknesses in the first area of the semiconductorwafer are, however, preferably more than 50% thicker than thethicknesses of the semiconductor wafer in the second area.

FIGS. 1 a and 1 b also show the first surface area 5 a and the secondsurface area 5 b of the body 2, in which the second surface area 5 bprojects with respect to the first surface area 5 a by a protrusion V.This protrusion V allows both the first area 7 a and the second area 7 bof the thinned semiconductor wafer 7 to rest on the surface of thesubstrate holder 5. This allows the semiconductor wafer 7 to besupported better, in order to prevent excessive bending of thesemiconductor wafer.

The protrusion V of the second surface area 5 b with respect to thefirst surface area 5 a ideally corresponds to the thinning of thesemiconductor wafer 7, that is to say if semiconductor wafers are usedwhich have been thinned from 400 micrometers to 140 micrometers (260micrometer thinning), then a protrusion V of 260 micrometers wouldensure that the first and second areas 7 a, 7 b of the semiconductorwafers 7 can each rest on the respective first and second surface areas5 a, 5 b of the substrate holder, without the thinned second area 7 b ofthe semiconductor wafer bending.

It is also advantageous for the first and the second surface areas 5 a,5 b to be coplanar with respect to one another. This allows the coplanarsurfaces of the first area 7 a and of the second area 7 b to rest on thesurface 5 of the substrate holder 1 in the entire overlapping area.

In some embodiments, substrate holder 1 is an integrally produced bodycomposed of metal, quartz, ceramic or for example aluminium. Ifaluminium is used, the substrate holder 2 offers the semiconductor wafer7 adequate strength in order to support it during processing steps suchas electrical testing, sawing or marking. Furthermore, thealuminium-oxide layer which is formed in the atmosphere on the surface 5of the body 2 offers a good barrier in order to prevent diffusion of thebody material into the semiconductor wafer 7, which would contaminatethe semiconductor wafer. At the same time, the electrically insulatingaluminium-oxide layer can be used to build up an electrical fieldbetween the semiconductor wafer 7 and the substrate holder 5, by meansof which the semiconductor wafer 7 is pressed against and held on thesubstrate holder 5. The semiconductor wafer 7 can thus be held inposition on the substrate holder 5 even when a lateral force is exertedon the semiconductor wafer 5, or if the substrate holder is tilted orturned over during transportation.

At this point, it should be stated that aluminium is only one of a largenumber of possible materials for the substrate holder. Depending on therequirements for the treatment of the semiconductor wafer, the materialswhich are used for the semiconductor wafer may also be other metals,such as copper, gold or alloys (brass) of these metals, for examplebrass. The materials used may also be insulating materials, such asplastic, Teflon, epoxy or ceramic. A coating of different materials isalso feasible. For example, it may be necessary to apply an insulatingthin layer to an electrically conductive substrate holder 7 in order toelectrically isolate the semiconductor wafer from the substrate holder 5or, as already mentioned, to apply an electrical field.

It should also be stated that the rotational symmetry of the substrateholder 1 illustrated in FIGS. 1 a-1 b is often advantageous, but it isnot necessary for the apparatus according to the invention. For example,the projecting second surface area may also be quadrilateral orpolygonal with any desired number of sides n (n=1, 2, 3, . . . ), or maybe any desired rotation body. The second surface area 5 b may also becomposed of a plurality of surface area elements, which preferably havethe same protrusion V with respect to the first surface area 5 a. Inthis case, the substrate holder could have a plurality of projectingelements, whose respective projecting surface elements support thethinned (second) semiconductor wafer area 7 b as points, at so manypoints that the thinned semiconductor wafer area 7 b cannotsignificantly bend.

FIG. 2 shows an apparatus for holding a substrate as in FIG. 1 a, inwhich the second surface area is arranged such that it can move withrespect to the first surface area, according to some embodiments of theinvention. In some embodiments, FIG. 2 includes an embodiment similar tothat shown in FIGS. 1 a-b. However, the body 1, in contrast to FIGS. 1a-b, is in the present case composed of two body elements 2 a, 2 b, withthe first body element 2 a having the first surface area 5 a, and thesecond body element 2 b having the second surface area 5 b. The two bodyelements 2 a, 2 b are connected to one another such that the secondsurface area 5 b can be shifted in a vertical movement direction M withrespect to the first surface area 5 a. The vertical movement direction Mmay, for example, be produced by a sliding guide between the first bodyelement 2 a and the second body element 2 b. This makes it possible tovary the protrusion V, so that it can be flexibly matched tosemiconductor wafers 7 with different degrees of thinning andthicknesses.

Additionally, FIG. 2 shows, schematically, two compressed springs 64,which force the first body element 2 a and the second body element 2 bapart from one another (and thus the first surface area 5 a and thesecond surface area 5 b apart from one another). This allows the secondsurface area 5 b of the substrate holder 1 to be pressed against thesecond (thinned) area 7 b of the semiconductor wafer 7, in order toproduce a touching contact. If this pressure is less than the pressureresulting from the intrinsic weight of the thinned area 5 b, then thespringing can be used to reduce the bending of the thinned area 5 b. Inparticular, the springing can prevent bending of the thinnedsemiconductor wafer area when additional forces are exerted on thethinned area, for example when contact needles or probe cards are placedon the thinned area 7 b in order to test the electrical serviceabilityof an integrated circuit on the semiconductor wafer.

FIG. 3 shows an apparatus for holding a substrate as in FIG. 1 a, inwhich the first and the second surface areas are formed in aninterlocking manner with respect to the semiconductor wafer, accordingto some embodiments of the invention. FIG. 3 shows a further embodiment,in contrast to FIGS. 1 a-b, where the first and the second surface areas5 a, 5 b are arranged such that the surface 5 of the substrate holder 1is connected in an interlocking manner to the semiconductor wafer 7. Inparticular, the second (thinned) area 7 b of the semiconductor wafer isessentially precisely of the same size as the second (projecting)surface area 5 b of the body 2, and the protrusion V is of precisely thesame size as the thinning of the semiconductor wafer 7. This allows theentire thinned area 7 b of the semiconductor wafer 7 to be supportedwhen the semiconductor wafer 7 is placed on the substrate holder 1. Thisallows the thinned area to be loaded with a probe card everywhere, or tobe sawn, without the thinned area 5 b of the semiconductor wafer beingbent or being broken. The gap between the first surface area 5 a and thefirst area 7 a of the semiconductor wafer 7 is preferably less than 100micrometers, and as far as possible even less than 50 micrometers, overthe entire first surface area. In the same way, the gap between thesecond surface area 5 b and the second area 7 b of the semiconductorwafer 7 is as far as possible less than 100 micrometers and as far aspossible even less than 10 micrometers over the entire first surfacearea.

The interlocking nature is as far as possible also provided in thetransitional area 5 c, that is to say the area in which the firstsurface area 5 b merges into the second surface area 5 b. In this area,it is preferably for the gap between the semiconductor wafer 7 and thebody 5 to be less than 1000 micrometers, and as far as possible evenless than 500 micrometers, over the entire first transitional area 5 c.The interlocking nature in the transitional area 5 c ensures that thesemiconductor wafer 7 is also fixed at the side, so that thesemiconductor wafer 7 remains in position even when lateral forces areexerted on the semiconductor wafer 7.

A further advantage of an interlocking connection between thesemiconductor wafer and the substrate holder body 2 is that a forcepressing on the substrate holder body 2 can be exerted on thesemiconductor wafer 7 without it being possible for the thinnedsemiconductor wafer area 7 b to bend. The pressing force allows thesemiconductor wafer 7 to be fixed better on the substrate holder body 2.

By way of example, FIG. 3 shows two openings 20 a in the first surfacearea 5 a, and two openings 20 b in the second surface area 5 b, whichcan be connected via corresponding channels 22 to a vacuum pump or to areduced-pressure reservoir. This makes it possible to produce a reducedpressure between the semiconductor wafer 7 and the substrate holder body3, which presses the thinned area 7 b and the thick area 7 a uniformlyonto the surface 5 of the substrate holder body. Thus, in particular,the thinned area 7 b of the semiconductor wafer 7 rests firmly on thesecond surface 5 b.

At this point, it should be stated that FIG. 3 is only provided as aschematic and by way of example. In some embodiments, it may besufficient for the openings 20 a, 20 b to be arranged only in the secondsurface area 5 b, since only the thinned area 7 b need be pressed ontothe substrate holder body 5 b. Similarly, in some embodiments, it isfeasible for the openings 20 a, 20 b to be arranged only in the firstsurface area 5 b, in order to protect the thinned area 7 b from thepressing pressure.

Furthermore, there are design options as to how many openings 20 a, 20 bare provided on the first and/or second surface areas 5 a, 5 b, wherethese are intended to be arranged, and how large they are intended tobe. These options depend on how thin and sensitive the thinned area 7 bof the semiconductor wafer 7 is, how powerful the pump is, etc. that iswithin the scope of what a person skilled in the art that can be carriedout for any given application.

FIG. 4 shows an apparatus for holding a substrate as in FIG. 1 a, inwhich the tips of contact needles form the second surface area,according to some embodiments of the invention. FIG. 4 shows,schematically, a further embodiment which, in some embodiments, is thesame as that in FIG. 2. In contrast to FIG. 2, in some embodiments, FIG.4 has a plurality of projecting contact needles 66, however, which each,at their tip, form second surface areas 5 b of the size of needlepoints. As indicated in FIG. 2, the contact needles 66 can each bemounted on a spring 64, which springs 64 press the contact needles alonga guide rail (not shown) in a vertical movement direction M in thedirection of the thinned area 7 b of the semiconductor wafer 7. Thismakes it possible for each contact needle 66 on the one hand to make anadditional electrical contact with the semiconductor wafer 7. At thesame time, the contact needles can support the thinned semiconductorwafer area 7 b, in order that this does not droop or break outwardsunder external pressure.

The embodiment shown in FIG. 4 is a further example, which isrepresentative of a large number of variation options. For example, thenumber of needles can be adapted and varied as required. Rounded orflattened contact bodies may be used instead of the needles 66. Thenature of the sprung suspension of the contact needles 66 in thesubstrate holder body 2 can also be varied in many ways. For example,instead of the springs, it is possible to use elastic materials, such asan elastic medium composed of a rubber, or a hydraulic drive, or astepping motor. For high-voltage components, the surface is typicallycomposed of gold. This allows the protrusion V to be matched todifferent semiconductor wafer types. Furthermore, if the contact needlesare able to support the thinned semiconductor wafer area sufficiently,the substrate holder body 2 can be provided with openings 20 in order toallow a vacuum to be applied between the semiconductor wafer 7 and thesubstrate holder body 2, for better retention.

FIG. 5 shows a measurement apparatus 100 for measurement of asemiconductor wafer, according to some embodiments of the invention.Apparatus 100 includes a substrate holder 1, a semiconductor wafer 7which has been thinned in the central area, a contact-making apparatus30 for making contact with the semiconductor wafer 7, a voltage source32, by means of which an electrical voltage can be applied to thesemiconductor wafer 7 via the contact-making apparatus 30 and thethinned surface of the semiconductor wafer 7, and a voltage measurementdevice 34, which measures the voltage tapped off at a desired point inthe circuit. The above arrangement allows for testing of an electricalcircuit which is integrated on the thinned semiconductor wafer area 7 b.

In some embodiments, the substrate holder body 2 has a first surfacearea 5 a and a second surface area 5 b. The second surface area 5 bprojects by a distance V with respect to the first surface area 5 a. Thedistance V corresponds to the thinning depth with which thesemiconductor wafer 7 was thinned in a previous thinning process. Thesecond surface areas 5 a, 5 b and the transitional area 5 c, for examplea step, are shaped such that they can be connected in an interlockingmanner to the semiconductor wafer 7, which has been thinned selectivelyin the central area and whose geometry is predetermined. Theinterlocking connection between the thinned semiconductor wafer side andthe surface areas 5 a, 5 b, 5 c of the substrate holder surface 5 isdesigned such that the gap between the semiconductor wafer 7 and thesurface of the substrate holder body 2 is less than 50 micrometerseverywhere. This results in the semiconductor wafer 7 being supportedwell over the entire lower face, in order to allow contact-makingelements, for example contact needles 64, to be placed on the upper faceof the semiconductor wafer 7, without destroying the thinned areas ofthe semiconductor wafer 7.

In some embodiments, the substrate holder body 2 in FIG. 5 is anintegral body composed of aluminium which is coated on its surface witha thin layer 26 composed of gold or silver and with a thickness, forexample, of 50 micrometers. A good electrical contact can be madebetween the substrate holder body 2 and the thinned side of thesemiconductor wafer 7 through the gold (or silver) layer 26. This allowsthe thinned side of the semiconductor wafer 7 to be earthed or, forexample, to be used as a drain contact for a vertical power transistor(not shown).

By way of example, the substrate holder body 2 also has six openings 20a, 20 b, which are connected to channels 22, which allow connection to avacuum pump. This makes it possible to press the semiconductor wafer 7onto the substrate holder body 2 by means of a reduced pressure betweenthe semiconductor wafer and the surface 5, 5 a, 5 b, so that a goodelectrical contact can be made between the gold layer 26 and the thinnedsurface of the semiconductor wafer 7.

The semiconductor wafer 7 in FIG. 5 is once again one of the waferswhich have been thinned in the inner area 7 b, as have already beendescribed in the previous embodiments. By way of example, it may becomposed of silicon. The semiconductor wafer 7 may already have beenprocessed to such an extent that one or more integrated circuits, forexample with one or more power transistors with a gate connection andsource connection (not shown in the figure) have been integrated on thesemiconductor wafer 7. That surface of the semiconductor wafer 7 whichis opposite the integrated circuit may subsequently have been etchedselectively with respect to a concentric mask applied in advance in thecentral area, that is to say in the second semiconductor wafer area 7 b,to such an extent that the electrical resistance from the circuit faceto the thinned face has fallen below a maximum permissible value. Thethickness of the semiconductor wafer 7 in the thinned area may thentypically be, for example, 140 micrometers. The semiconductor wafer 7illustrated in FIG. 5 may, but need not be, a wafer that has beenprepared in this manner.

For illustrative reasons, the contact-making shape 30 is shown onlyschematically. The figure shows two contact needles 66, which are eachattached to a manipulator 68 in order to allow the contact needles to bemoved vertically, and laterally with respect to this, to a desiredposition on the semiconductor wafer 7. One of the contact needles 66 isconnected via a line to the voltage source 32, that at the other end isconnected to earth and to the substrate holder body 2. This allows thecontact needle 66 to be set to a desired voltage relative to earth andrelative to the substrate holder body 2.

The second illustrated contact needle 66 in FIG. 5 is, in contrastconnected to a current measurement device 34. This contact needle canthus measure voltages (which are produced by the currents caused by thevoltage source 32 from the front face to the rear face of thesemiconductor wafer 7) at different points in the circuit.

The present measurement layout is clearly only one of a large number ofoptions. Probe cards are often used instead of two or more manipulators68 with needles 66, and have 10, 100 or even more preadjusted needles.The more needles, the greater is the pressure on the semiconductorwafer. The second surface area 5 b, which supports the thinnedsemiconductor wafer area 7 b, allows the forces produced by the probecard on the semiconductor wafer 7 to be absorbed.

FIG. 6 shows, schematically, one embodiment of an apparatus forseparation of a substrate 200. An apparatus such as this may be used,for example, to break up the semiconductor wafer 7 into 10, 100 or evenmore individual chips.

FIG. 6 once again shows a substrate holder 1, a semiconductor wafer 7which has been thinned in the central area and has been placed on thesubstrate holder 1 in an interlocking manner, and, schematically, a saw,which has partially penetrated into the thinned (second) area of thesemiconductor wafer 7 in order to separate it.

The present substrate holder body 2 is largely identical to thesubstrate holder body 2 in FIG. 5. The same reference symbols thusrelate to the same elements. In contrast to FIG. 5, the substrate holderbody in FIG. 6 does not, however, have any gold or silver layer, but aninsulating (dielectric) layer, for example an aluminium-oxide layer 24.There is no need for a gold layer since, during the sawing process,there is no need for an electrical contact between the substrate holderbody 2 and the semiconductor wafer 7. The insulating aluminium-oxidelayer 24 which is formed on the aluminium also prevents diffusion ofaluminium from the substrate holder body 2 into the semiconductor wafer7.

As in FIG. 5, the substrate holder body 2 in FIG. 6 has a first surfacearea 5 a and a second surface area 5 b. The second surface area 5 bprojects by a distance V with respect to the first surface area 5 a. Thedistance V corresponds to the thinning depth, with which thesemiconductor wafer 7 has been thinned in a previous thinning process.The second surface areas 5 a, 5 b and the transitional area 5 c, forexample a step, are shaped such that they can be connected in aninterlocking manner to the semiconductor wafer 7 which has been thinnedselectively in the central area and whose geometry is predetermined. Theinterlocking connection between the thinned semiconductor wafer side andthe surface areas 5 a, 5 b, 5 c of the substrate holder surface 5 isdesigned such that the gap between the semiconductor wafer 7 and thesurface of the substrate holder body 2 is less than 50 micrometerseverywhere. The substrate holder body 2 in FIG. 6 is an integral bodycomposed of aluminium, on which a natural insulating aluminium-oxidelayer 24 is grown.

Once again, by way of example, the substrate holder body 2 has sixopenings 20 a, 20 b, which are connected to channels 22 which allow aconnection to a vacuum pump. This makes it possible to press thesemiconductor wafer 7 against the substrate holder body 2 by means of areduced pressure between the semiconductor wafer and the surface 5, 5 a,5 b, so that the semiconductor wafer 7 does not slide while being sawn.

The semiconductor wafer 7 in FIG. 6 may be one of the wafers which havebeen thinned in the inner area 7 b, as in FIG. 5. The sawing step ispreferably carried out after the production of the integrated circuitand after the electronic circuit test. After being separated, thosechips which originate from the thinned (second) semiconductor wafer area7 b are preferably used for further processing.

FIG. 6 shows an apparatus for marking and separation of a substrate,according to some embodiments of the invention. Apparatus shown in FIG.6 includes a horizontal spindle saw 70, which is used for separation ofthe semiconductor wafer 7. This has a rapidly rotating diamond sawblade, which is passed in straight lines over the semiconductor wafer.During the process, the saw digs into the semiconductor wafer 7 untilthe wafer has been cut through. The sawing process along a plurality ofparallel lines in mutually perpendicular directions allows thesemiconductor wafer 7 to be broken up into numerous rectangular chips.Because of the support by the first and second surface areas 5 a and 5 bof the substrate holder, the thinned second area 7 b of thesemiconductor wafer 7 cannot bend and break up in an uncontrolled mannerduring the sawing process. Because of the interlocking connectionbetween the substrate holder 5 and the semiconductor wafer 7, thesemiconductor wafer also cannot be moved in an uncontrolled mannerduring the sawing process. Even very thin semiconductor wafers can besawn in a controlled manner in this way. A laser (dry or water guided)can also be used for the separation process.

FIG. 6 also shows, schematically, a marking apparatus 300, which has anink dispenser 301 and a manipulator 300 which can move the ink dispenserin the vertical and horizontal directions in order to allow it to movethe ink dispenser 301 to any desired point on the semiconductor wafer 7,in order to allow the semiconductor wafer 7 to be marked with ink there.The marking may, for example, comprise a dot with which a predeterminedsemiconductor circuit element is provided in order to indicate that thissemiconductor circuit element is defective and, after being separated bythe saw 70, is to be thrown away. The marking apparatus 301 can be usedat a plurality of points during the processing of the semiconductorwafer 7, for example during or after the test.

By way of example, FIGS. 7 a-7 c show a method for treatment of asemiconductor wafer 7, according to some embodiments of the invention.

FIG. 7 a shows a semiconductor wafer 7 with a homogeneous thickness of,for example, 400 micrometers, after it has been provided on one mainsurface 8 with a photosensitive varnish layer which has subsequentlybeen structured photolithographically to form a mask 14. In the presentcase, the mask 14 has been structured such that a “ring” with a lateralring width B remained only at the outer edge of the semiconductor wafer7. The lateral ring width is typically chosen such that it stillprovides sufficient mechanical robustness to the semiconductor wafer 7after it has been thinned.

FIG. 7 a also shows, optionally and schematically, three integratedcircuits 18, which are integrated on the unmasked main surface (activemain surface) of the semiconductor wafer 7. The integrated circuits 18have been applied to the semiconductor wafer 7 with the aid ofconventional microelectronic production methods. After this, the activeside of the semiconductor wafer 7 was then first of all applied to amount 16, for example a flexible film or a polymer mat (for exampleepoxy resins). The mount 16 allows the semiconductor wafer 7 to betransported in a protected manner, and protects the integrated circuits18 during the following etching and processing steps.

FIG. 7 a also shows, schematically, the etching step 70 which is carriedout after the masking process in order to selectively thin thesemiconductor wafer with respect to the mask 14 on the main surface 8.This results in the masked area of the semiconductor wafer remaining inorder to form a “thick” first area 7 a, while the unmasked area isthinned to a desired extent by the etching process. The thinning processcan typically be carried out, for example, from 400 micrometers to 140micrometers, in which case these values can be varied as desired,depending on the purpose and the original semiconductor wafer material.The etching process can be carried out, for example, wet-chemically ordry-chemically.

In this context, it should be mentioned that the annular structuring ofthe semiconductor wafer 7 is only one of a large number of options. If,by way of example, the semiconductor wafer is very large, for example 12inches, and if the thinning of the semiconductor wafer is intended to bevery intensive in order to obtain a very thin “fertilized” area 7 b forexample of less than 50 micrometers, then it is feasible to design themask such that cruciform mask webs, for example, remain on thesemiconductor wafer rather than or in addition to the outer ring, afterthe thinning process. These “webs” can additionally support thefertilized area (second area) of the semiconductor wafer during thefurther treatment, and protect it against being broken.

FIG. 7 b shows the semiconductor wafer 7 after the selective etchingstep and after the removal of the mask 14, for example by combustion.This leaves the semiconductor wafer 7 with an annular “thick” area 7 aand a thinned area 7 b surrounded by the ring. Only the ring remains ofthe original surface 8. The active main surface is also covered by themount 16.

FIG. 7 c shows a further process step, in which the semiconductor waferhas been flipped and its etched surface has first of all been placed onthe substrate holder body 2 (chuck). The chuck has two surface areas,(a) the first surface area 5 a and (b) the surface area 5 b, whichprojects by the protrusion V beyond the first surface area. Theprotrusion V is designed such that it corresponds precisely to thethinning in the previous selective etching step. In consequence, boththe thick area 7 a and the thinned area 7 b of the semiconductor wafer 7rest on it, so that the thinned area 7 b is stabilized on the chuck 2for further processing.

In addition to the thinned area 7 b being supported by the chuck 2, thechuck also has 5 channels 22 via which the chuck 2 is connected to avacuum reservoir 27 and to a vacuum pump 28. The pump 28 makes itpossible to produce a reduced pressure via the channels 22 in the areabetween the semiconductor wafer and the chuck surface, that is to saybetween the semiconductor wafer 7 and the first surface area 5 a and thesecond surface area 5 b, by means of which the semiconductor wafer 7 isheld on the chuck 2, even when the chuck is tilted.

The reduced pressure between the semiconductor wafer 7 and the chucksurface also makes it possible for the mount 16 to be pulled off thesensitive thinned semiconductor wafer area 7 b without damaging orbreaking the thinned area 7 b. This is possible because the reducedpressure presses the thinned semiconductor wafer area 7 b onto theplanar second surface 5 b of the chuck 2, thus preventing the mount frompulling the thinned area 7 b upwards when it is pulled off thesemiconductor wafer 7.

Furthermore, a method is provided herein for treatment of a substrate,which comprises selective removal of semiconductor wafer material on onemain surface (8) of a semiconductor wafer (7), such that thesemiconductor wafer is thicker in a first area (7 a) of thesemiconductor wafer (7) than in a second area (7 a) of the semiconductorwafer (7), as well as application of the main surface (8) of thesemiconductor wafer (7) to an apparatus for holding the semiconductorwafer (1), with both the first area (7 a) and the second area (7 b)resting on the apparatus (1) for holding the semiconductor wafer.

Also provided herein is a method for treatment of a substrate comprisingselective removal of semiconductor wafer material on a main surface (8)of a semiconductor wafer (7), such that the semiconductor wafer isthicker in a first area (7 a) of the semiconductor wafer (7) than in asecond area (7 a) of the semiconductor wafer (7), and application of themain surface (8) of the semiconductor wafer (7) to an apparatus forholding the semiconductor wafer (1) in which both the first area (7 a)and the second area (7 b) rest on the apparatus (1) for holding thesemiconductor wafer. Additionally, the removal of the semiconductorwafer material is carried out by mechanical grinding, dry orwet-chemical etching, mechanical polishing and/or laser removal.

In some embodiments, the semiconductor wafer (7) is processed by meansof at least one of the following steps, namely: pressing of thesemiconductor wafer (7) onto the apparatus for holding the substratedescribed earlier, providing a separation of the semiconductor wafer (7)from a mount (or a chuck), coating of the semiconductor wafer (7),making contact with the semiconductor wafer (7), etching of thesemiconductor wafer (7), marking of the semiconductor wafer (7),breaking up the semiconductor wafer (7); and transportation of thesemiconductor wafer (7). Additionally, in some embodiments, the secondarea (7 b) of the semiconductor wafer (7) rests on a surface whichoccupies at least half the area of the semiconductor wafer (7).

Finally, it should once again be stated that the embodiments explainedin this description are only examples and do not limit the invention. Inparticular, it is obvious to a person skilled in the art that theindividual features of the embodiments can be combined or developedfurther depending on the application without this combination departingfrom the idea of the invention. For example, while the figures showexemplary embodiments in which the semiconductor wafer 7 is pressed ontothe surface 5 of the substrate holder body 2 by means of a reducedpressure, each of these examples may, for example, use mechanicalbrackets rather than a reduced pressure, which brackets press thesemiconductor wafer 7 onto the surface 5 of the substrate holder body 2.Alternatively, it is also possible to use an electrical field, which isbuilt up by means of an external voltage between the semiconductor wafer7 and the substrate holder body 2, and thus presses the semiconductorwafer 7 onto the surface 5 of the substrate holder body 2.

What is claimed is:
 1. A method comprising: placing a semiconductorwafer in contact with a substrate holder at a first location and asecond location of the substrate holder, wherein the second locationprojects with respect to the first location; supporting a thinnedportion of the semiconductor wafer using the second location; andprocessing the semiconductor wafer.
 2. The method of claim 1, furthercomprising producing a reduced pressure between the semiconductor waferand the substrate holder.
 3. The method of claim 1, further comprisingmoving the second location with respect to the first location until thefirst location is in contact with the semiconductor wafer and the secondlocation is in contact with the semiconductor wafer.
 4. The method ofclaim 1, further comprising forcing the second location away from thefirst location.
 5. The method of claim 4, wherein forcing the secondlocation away from the first location further comprises forcing thesecond location away from the first location with springs.
 6. The methodof claim 1, further comprising pressing a contact needle in a directionof the semiconductor wafer.
 7. The method of claim 1, further comprisingpressing a plurality of contact needles in a direction of thesemiconductor wafer.
 8. The method of claim 1, wherein placing thesemiconductor wafer in contact with the substrate holder furthercomprises placing the semiconductor wafer in contact with the substrateholder at a first surface area and a second surface area of thesubstrate holder, wherein the second surface area projects with respectto the first surface area.
 9. The method of claim 1, wherein processingthe semiconductor wafer further comprises measuring the semiconductorwafer.
 10. A method comprising: disposing a main surface of asemiconductor wafer on an apparatus for holding the semiconductor waferincluding a body with a surface, the surface having a first surface areaon which a first area of the semiconductor wafer can rest and a secondsurface area on which a second area of the semiconductor wafer can rest,wherein the second surface area protrudes with respect to the firstsurface area and the first area is thicker than the second area; andprocessing the semiconductor wafer.
 11. The method of claim 10, furthercomprising pressing the semiconductor wafer onto the apparatus forholding the semiconductor wafer.
 12. The method of claim 10, furthercomprising providing a separation of the semiconductor wafer from amount or a chuck.
 13. The method of claim 10, further comprising makingcontact with the semiconductor wafer.
 14. The method of claim 10,further comprising marking the semiconductor wafer.
 15. The method ofclaim 10, further comprising breaking up the semiconductor wafer. 16.The method of claim 10, further comprising transporting thesemiconductor wafer.
 17. A method comprising: placing a first portion ofa semiconductor wafer on a planar surface of a first body portion of anapparatus for holding the semiconductor wafer; placing a second portionof the semiconductor wafer on a planar surface of a second body portionof the apparatus for holding the semiconductor wafer, the planar surfaceof the second body portion being offset from the planar surface of thefirst body portion, wherein the second portion of the semiconductorwafer is thinner than the first portion of the semiconductor wafer; andprocessing the semiconductor wafer.
 18. The method of claim 17, furthercomprising forcing the planar surface of the second body portion awayfrom the planar surface of the first body portion.
 19. The method ofclaim 18, wherein forcing the planar surface of the second body portionaway from the planar surface of the first body portion further comprisesforcing the planar surface of the second body portion away from theplanar surface of the first body portion with a spring.